Здравствуйте, Яна!The molding compounds are available in extreme soft flows and long
gelation times, which make them very adaptable for encapsulation molding
techniques in the encapsulation of electronic components such as integrated
circuits, resistors, diode capacitors, relays, and bobbins [12].The compounds
also found a market in the commercial and military industrial areas for
connector bodies, potting shells, printed circuit boards, coils, and bobbins
with the higher-strength and higher fil
Здравствуйте, Галина! These important property values enable the product designer, manufacturing engineer, and research and design engineer to select from a wide choice of products, and enable them to choose the most suitable molding compound to
meet their specific needs and requirements. These versatile materials are
covered by military, industrial, and commercial specifications that are
designed to ensure the quality of the molded articles utilizing thermosetting
molding compounds
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